Kasia received her MSc in solid state physics from the Faculty of Physics, University of Warsaw, Poland, in 2004. Then, she continued her education as a PhD student at the same university. She studied the optical properties of semiconductor quantum wells and quantum dots.
Kasia joined the group in 2015 as a research and cleanroom technician. She is involved in the improvement and development of the Liquid Crystal on Silicone devices assembling process.
Kasia is responsible for the dicing saw. It includes processing various materials, dicing processes development, saw maintenance, training, and communication with external users and customers.
She also assists the group members with a wide variety of tasks depending on actual research directions and needs.
